IEEE ICICDT 2017 |
Austin, Texas, USA May 23rd - 25th, 2017 |
WELCOME TO THE 2017 ICICDT
The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas/findings and collaborating effectively. A one-day tutorial program aims on the current hot topics for both the beginner and expert precedes two days of technical presentations and workshops. The 2017 ICICDT topics include:
- Advanced materials and processing technologies
- Advanced transistor and interconnect structures
- Interposer/Three-Dimensional (2.5D/3D) integration
- Variation-tolerant designs
- Process and design techniques for soft errors, plasma-induced damage, and reliability
- Advanced memory devices and circuits
- RF, analog, mixed signal, and I/O circuits for future technology generations
- Simulation and modeling of advanced processes, devices, and circuits
- EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
- Design for manufacturing, yield, and test
- System-on-Chip (SoC) and system-in-package (SiP) design integration
- Power semiconductor technologies and circuits
- Emerging technologies, circuits and Applications (Internet of Thing, Autonomous cars)
2017 Conference Chair:
Bich-Yen Nguyen (Soitec, [email protected])