International Conference on IC Design and Technology

ICICDT 2016 Home


Ho Chi Minh City, Vietnam

June 27th - 29th, 2016


On behalf of the technical program and organizing committees, we welcome you to the 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT). Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance and better energy efficiency while the time to market continues to accelerate, future IC engineers will require a deeper understanding of the interdependencies between design and technology to expand the product optimization window. ICICDT is the forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development. The 2016 conference is a joint event between the ICICDT-2016 and the 4th Solid State Systems Symposium – VLSIs and Semiconductor Related Technologies (4S-2016). The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively. A one-day tutorial program for both the beginner and expert precedes two days of technical presentations and workshops. The 2016 ICICDT topics include:

  • Advanced materials and processing technologies
  • Advanced transistor and interconnect structures
  • Three-dimensional (3D) integration
  • Variation-tolerant designs
  • Process and design techniques for soft errors, plasma-induced damage, and reliability
  • Advanced memory devices and circuits
  • RF, analog, mixed signal, and I/O circuits for future technology generations
  • Simulation and modeling of advanced processes, devices, and circuits
  • EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • Design for manufacturing, yield, and test
  • System-on-Chip (SoC) and system-in-package (SiP) design integration
  • Power semiconductor technologies and circuits
  • Emerging technologies and circuits

Dina Triyoso, Conference Chair
Keith Bowman, General Chair
Thuy Dao, Executive Committee Chair
Andrea Scarpa, Secretary
Yuichiro Mitani, Treasurer

Technical Co-Sponsorship