International Conference on IC Design and Technology

ICICDT 2014 Home

ICICDT 2014

Austin, Texas

May 28th - 30th, 2014

News

Call for papers

Feb 24th: Deadline for Paper Submissions

May 1st: Deadline for Early Registration

WELCOME TO THE 2014 ICICDT

On behalf of the technical program and organizing committees, we welcome you to the 2014 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT) at the Advanced Micro Devices (AMD) Austin Lone Star Campus in Austin, Texas, U.S.A. Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance and energy efficiency while the time to market continues to accelerate, future IC engineers will require a deep understanding of the interdependencies between design and technology to expand the product optimization window. ICICDT is the forum for engineers, researchers, professors, and graduate students to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development. The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively. A one-day tutorial program for both the beginner and expert precedes two days of technical presentations and workshops. The 2014 ICICDT topics include:

  • Advanced materials and processing technologies
  • Advanced transistor and interconnect structures
  • Three-dimensional (3D) integration
  • Variation-tolerant designs
  • Process and design techniques for soft errors, plasma-induced damage, and reliability
  • Advanced memory devices and circuits
  • RF, analog, mixed signal, and I/O circuits for future technology generations
  • Simulation and modeling of advanced processes, devices, and circuits
  • EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • Design for manufacturing, yield, and test
  • System-on-Chip (SoC) and system-in-package (SiP) design integration
  • Power semiconductor technologies and circuits
  • Emerging technologies and circuits

ICICDT is thankful for the technical support from the IEEE Central Texas Section (CTS), the IEEE Electron Devices Society (EDS), the Institute of Electronics, Information, and Communication Engineers (IEICE), and the Japan Society of Applied Physics.

Keith Bowman, Conference Chair
Andrea Scarpa, General Chair
Thuy Dao, Executive Committee Chair
Yuichiro Mitani, Secretary
Dina Triyoso, Treasurer

2014 ICICDT Venue:

Advanced Micro Devices (AMD), Austin Lone Star Campus, 7171 Southwest Parkway, Austin, Texas 78735, U.S.A.

Technical Co-Sponsorship